Dongguan Ziitek Electronical Material and Technology Ltd.

Dongguan Ziitek Electronical Material and Technology Ltd. Professional TIM Manufacturer

Manufacturer from China
Verified Supplier
7 Years
Home / Products / Silicone Thermal Pad /

Silicone Thermal Pad Thermal Gap Filler With Thermal Conductivity 1.2W/M.K Work For Computer Laptop Desktop CPU Cooling

Contact Now
Dongguan Ziitek Electronical Material and Technology Ltd.
Visit Website
City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
Contact Now

Silicone Thermal Pad Thermal Gap Filler With Thermal Conductivity 1.2W/M.K Work For Computer Laptop Desktop CPU Cooling

Ask Latest Price
Video Channel
Brand Name :Ziitek
Model Number :TIF100-66U Series
Certification :RoHS and UL recognized
Place of Origin :China
MOQ :1000pcs
Price :0.1-10 USD/PCS
Payment Terms :T/T
Supply Ability :1000000 pcs/month
Delivery Time :3-5 work days
Packaging Details :24*13*12cm cartons
Products name :Silicone Thermal Pad Thermal Gap Filler With Thermal Conductivity 1.2W/M.K Work For Computer Laptop Desktop CPU Cooling
Keywords :Silicone Thermal Pad
Thinkness range :0.010"(0.25mm)~0.200" (5.0mm)
Sample :Sample Avaliable
Flam rating :94 V0
Hardness :27±5 Shore 00
Thermal Conductivity :1.2W/mK
Color :Green
Application :Computer Laptop Desktop CPU Cooling
more
Contact Now

Add to Cart

Find Similar Videos
View Product Description

Silicone Thermal Pad Thermal Gap Filler With Thermal Conductivity 1.2W/M.K Work For Computer Laptop Desktop CPU Cooling

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Product description

TIF100-66U Series thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.

Features

> Good thermal conductive : 1.0W/mK
> Soft and Compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thickness

> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized

Applications


> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Display card
> Telecommunication hardware
> Display card
> Mass storage devices
> Automotive electronics
> Set top boxes

Typical Properties of TIF100-66U Series
Color Green Visual
Construction & Compostion Ceramic filled silicone elastomer *******
Specific Gravity 2.1g/cc ASTM D297
Thickness range 0.010"(0.25mm)~0.200" (5.0mm) ASTM C351
Hardness (thickness ≥1.0mm) 27±5 Shore 00 ASTM 2240
Dielectric Breakdown Voltage >5500 VAC ASTM D412
Operating Temp -40 ~160℃ *******
Dielectric Constant 4.0 MHz ASTM D150
Volume Resistivity 1.0X1012Ohm-meter ASTM D257
Fire rating 94-V0 equivalent UL
Thermal conductivity 1.2W/mK ASTM D5470

Product Specification


Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)

Product Sizes: 8" x 16"(203mm x406mm)

Individual die cut shapes and custom thickness can be supplied. Please contact us for confirming.

Safe disposal method does not require special protection.The storage condition is low temperature and dry,

away from open fire and away from direct sunlight. For detailed method, please refer to the product material safety data sheet.

Silicone Thermal Pad Thermal Gap Filler With Thermal Conductivity 1.2W/M.K Work For Computer Laptop Desktop CPU Cooling

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials.

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract.

5.Free sample offer.

6.Quality assurance contract.

Silicone Thermal Pad Thermal Gap Filler With Thermal Conductivity 1.2W/M.K Work For Computer Laptop Desktop CPU Cooling

Inquiry Cart 0