Dongguan Ziitek Electronical Material and Technology Ltd.
Dongguan Ziitek Electronical Material and Technology Ltd. Professional TIM Manufacturer
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2W High Quality Factory Customized Thermal Pad Thermal Gap Filler Insulation Sheet Silicone Pad For LED CPU GPU MOS
Company Profile
With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Product introduction
TIF520-20-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
Features
> Good thermal conductive: 2.0W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance
Applications
> Cooling components to the chassis of frame
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Memory Modules
> Mass storage devices
> Mass storage devices
> Automotive electronics
> Set top boxes
> LED Ceilinglamp
> Monitoring the Power Box
> AD-DC Power Adapters
| Typical Properties of TIF520-20-11US Series | ||
| Property | Value | Test method |
| Color | Gray | Visual |
| Construction &Compostion | Ceramic filled silicone elastomer | *** |
| Thickness range | 0.5 mmT | ASTM D374 |
| Hardness | 20±5 Shore 00 | ASTM 2240 |
| Specific Gravity | 2.7 g/cc | ASTM D792 |
| Continuos Use Temp | -40 to 200℃ | *** |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 |
| Dielectric Constant | 4.5 MHz | ASTM D150 |
| Volume Resistivity | 1.0X10¹²Ohm-meter | ASTM D257 |
| Fire rating | 94 V0 | UL E331100 |
| Thermal conductivity | 2.0W/m-K | ASTM D5470 |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Independent R&D team
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