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Premium Soft 2.5W Blue-Violet Silicone Thermal Pad for Electronic Equipment
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
TIF®100N-25-16S series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, alowing it to conform fightly to heat sources with varying shapes and height dferences. Even in confined or iregular spaces,it maintains stable thermal conductivity, enabling efficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink. This significantly improves the heat dissipation efficiency of electronic components, thereby enhancing operational stability and extending device lifespan.
Features:
> Excellent thermal conductivity 2.5W/mK
> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure
> Available in different thickness options
> Easy release construction
> Electrically isolating
> High durability
Applications:
> Heat dissipation structure for radiators
> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles
> LED drivers and lamps
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices
> Automotive electronics
Typical Properties of TIF®100N-25-16S Series | ||
Color | Blue-Violet | Visual |
Construction & Compostion | Boron Nitride-Filled Silicone Rubber | ***** |
Specific Gravity | 1.6 g/cc | ASTM D792 |
thickness | 0.020"(0.5mm)~0.200"(5.00mm) | ASTM D374 |
Hardness (thickness<1.0mm) | 45 (Shore 00) | ASTM 2240 |
Continuos Use Temp | -40 to 200℃ | ****** |
Dielectric Breakdown Voltage | ≥5500 VAC | ASTM D149 |
Dielectric Constant | 2.8 MHz | ASTM D150 |
Fire rating | 94 V0 | UL (E331100) |
Thermal conductivity | 2.5 W/m-K | ASTM D5470 |
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated.
FAQ:
Q: Are you trading company or manufacturer ?
A: We are manufacturer in China.
Q: How do I place an order?
A:1. Click the "Sent messages" button to continue with the process.
2. Fill out the message form by entering a subject line, and message to us.
This message should include any questions you might have about the products as well as your purchase requests.
3. Click the "Send" button when you are finished to complete the process and send your message to us
4. We will reply you as soon as possible with Email or online
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.