Dongguan Ziitek Electronical Material and Technology Ltd.

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Soft and Compressible Thermal Pad High Conductivity for Low Stress GPU Applications

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Soft and Compressible Thermal Pad High Conductivity for Low Stress GPU Applications

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Brand Name :Ziitek
Model Number :TIF100-12055-62
Certification :UL & RoHS
Place of Origin :China
MOQ :1000pcs
Price :0.1-10 USD/PCS
Payment Terms :T/T
Supply Ability :1000000 pcs/month
Delivery Time :3-5 work days
Packaging Details :24*13*12cm cartons
Products name :Heat Dissipation Thermal Pads High Conductivity Thermal Pad For GPU
Keywords :Thermal Pad
Hardness :55 Shore 00
Thinkness range :0.020"(0.50mm)~0.200"(5.00mm)
Color :Gray
Flam rating :94 V-0
Features :Soft and compressible for low stress applications
Application :SSD CPU GPU Graphics Card Cooling
Thermal Conductivity :12.0W/mK
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Heat Dissipation Thermal Pads High Conductivity Thermal Pad For GPU

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

TIF®100 12055-62 series of thermal interface materials is specifically designed to fill air gaps between heat-generating components and heat sinks or metal baseplates. It offers excellent compliance, alowing it to conform fightly to heat sources with varying shapes and height dferences. Even in confined or iregular spaces,it maintains stable thermal conductivity, enabling efficient heat transfer from discrete components or the entire PCB to the metal housing or heat sink. This significantly improves the heat dissipation efficiency of electronic components, thereby enhancing operational stability and extending device lifespan.

Features:
> Excellent thermal conductivity 12.0W/mK

> Naturally tacky needing no further adhesive coating
> High compliance adapts to various pressure application environments
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant


Applications:
> Heat dissipation structure for radiators

> Telecommunication equipment
> Automotive electronics
> Battery packs for electric vehicles

> Cooling components to the chassis of frame
> High speed mass storage drives
> Handheld portable electronics
> Power supply
> Heat pipe thermal solutions
> Memory Modules
> Mass storage devices

Typical Properties of TIF®100 12055-62 Series
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Specific Gravity 3.3g/cc ASTM D792
thickness 0.020"(0.5mm)~0.200"(5.00mm) ASTM D374
Hardness (thickness<1.0mm) 55 (Shore 00) ASTM 2240
Continuos Use Temp -40 to 200℃ ******
Dielectric Breakdown Voltage ≥5000 VAC ASTM D149
Dielectric Constant 6.5MHz ASTM D150
Volume Resistivity ≥1.0X10¹²Ohm-meter ASTM D257
Fire rating 94 V0

UL94(E331100)

Thermal conductivity 12.0W/m-K ASTM D5470

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

Product Specification
Product Thicknesses: 0.03"(0.75mm)~0.200"(5.00mm) with increments of 0.01(0.25mm)
Product Sizes:16" x 16"(406mm x406mm)
Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment), DC1(Single-sided hardening).
Adhesive Options: A1/A2(Single-sided/Double-sided adhesive).
Notes:FG (Fiberglass) provides enhanced strength, suitable for materials with thicknesses of 0.01 to 0.02 inch (0.25to 0.5mm).
The TIF series is available in custom shapes and various forms.For other thicknesses or more information, please contact us.
Soft and Compressible Thermal Pad High Conductivity for Low Stress GPU Applications

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated.

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q:How can we get detailed price list?

A:Please offer us detailed information of the product such as Size(length,width,thickness),color,specific packaging requirements and purchasing quantity.

Q: What kind of packaging you offer?

A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.

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