Dongguan Ziitek Electronical Material and Technology Ltd.

Dongguan Ziitek Electronical Material and Technology Ltd. Professional TIM Manufacturer

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7 Years
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Works Under Low Pressure Carbon Fibre Based Thermal Pad For Optoelectronics industry

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Dongguan Ziitek Electronical Material and Technology Ltd.
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
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Works Under Low Pressure Carbon Fibre Based Thermal Pad For Optoelectronics industry

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Brand Name :Ziitek
Model Number :TS-TIR700-25
Certification :RoHS
Place of Origin :China
MOQ :1000pcs
Price :0.1-10USD/pcs
Payment Terms :T/T
Supply Ability :100000pcs/month
Delivery Time :3-8 work days
Packaging Details :24*13*12cm cartons
Products Name :Works Under Low Pressure Carbon Fibre Based Thermal Pad For Optoelectronics industry
keywords :Thermal Pad
Feature :Ultra-low thermal resistance
Thermal conductiivity :25W/m-K
Color :Gray
Hardness :75±10 /55±10 Shore 00
Material :Carbon fiber filled silicone
Density :2.9g/cc
Application :Optoelectronics industry
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Works Under Low Pressure Carbon Fibre Based Thermal Pad For Optoelectronics industry

Company profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL


Products introduction
TS-TIR®700-25 Series series is a high-performance carbon-based thermal pad that combines highly thermally conductive carbon fiber with polymer silicone materials. Utilizing advanced manufacturing processes to precisely distribute thermal pathways, it achievese xceptional thermal conductivity, effectively reducing interfacial thermal resistance and enhancing heat dissipation efficiency. With its ultra-thin, lightweight design and mechanical flexibility, it is suitable for 5G equipment, high-performance chips, and other high heat flux applications.

Feature

>Good thermal conductivity 25w/mK

>Ultra-low thermal resistance
>works under low pressure.

>Non-insulating material with electrical conductivity

>Non-adhesive surface

Application

>Between chips and heat dissipation modules

>5G communication equipment
>Optoelectronics industry

>wearable devices

Typical Properties of TIR®700-25 series
Product Name TIR®700-25 Test Method
Colour Gray Visual
Construction Carbon fiber filled silicone *****
Thickness range 0.01"~0.04" (0.3~1.0 mm) 0.06"~0.20"(1.5~5.0 mm) ASTM D374
Hardness 75±10 Shore 00 55±10 Shore 00 ASTM D2240
Density 2.9g/cm3 ASTM D792
Operation Temperature -40℃~ 200℃ ******
Thermal impedance 25.0W/m-K ASTM D5470
Specific heat capacity (J/g ℃) 0.75 ASTM E1269 @25℃
Flame Rating V-0 UL94
RoHS Compliant IEC62321

Product Specification
Standard Thickness:0.01" (0.3mm), 0.02"(0.5mm), 0.04"(1.0mm), 0.06" (1.5mm), 0.08" (2.0mm), 0.10" (2.5mm), 0.12" (3.0mm)

Standard Size: 1.97"×1.97"(50.0mm x 50.0mm)

Works Under Low Pressure Carbon Fibre Based Thermal Pad For Optoelectronics industry

Packaging Details & Lead time

1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us

4. We will reply you as soon as possible with Email or online.

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