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One Component Dealcoholized Thermally Conductive Silicone Adhesive for Room Temperature Curing Hardness 25 Shore A

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Province/State:guangdong
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One Component Dealcoholized Thermally Conductive Silicone Adhesive for Room Temperature Curing Hardness 25 Shore A

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Brand Name :Ziitek
Model Number :TIS580-12
Certification :RoHS
Place of Origin :China
MOQ :10kg
Price :1-100USD/KG
Payment Terms :T/T
Supply Ability :10000kg/month
Delivery Time :3-8 work days
Packaging Details :1kg/can
Products name :One Component Dealcoholized Room Temperature Cured Thermally Conductive Silicone Adhesive
Material :Silicone Adhesive
keyword :Thermally Silicone Adhesive
Total cure time :3-7 days (25℃)
Hardness :25(Shore A)
Feature :Room temperature cure
Thermal conductive :1.2W/mK
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One Component Dealcoholized Room Temperature Cured Thermally Conductive Silicone Adhesive​

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

TIS™580-12 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective.

TIS™580-12 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use.

TIS™580-12 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.

TIS580-12 Series Datasheet-(E)-REV01.pdf

One Component Dealcoholized Thermally Conductive Silicone Adhesive for Room Temperature Curing Hardness 25 Shore A

Feature

> Good thermal conductivity: 1.2W/mK

> Good maneuverability and good adhesion

> Low shrinkage

> Low viscosity, leads to void-free surface

> Good solvent resistance, water resistance

> Longer working life

> Excellent thermal shock resistance

Application

It mainly used in substituting thermally-conductive paste and pads, which currently finds in gap-filling adhesives or heat conduction between LED aluminium motherboard and heat sink, high power electrical module and heat sink. Traditional methods such as fins and screws fixing can be replaced by applying TIS580-12, resulting a more reliable gap-filling thermal conduction, simplified handling and more cost-effective.
E.g. Massive application in integrated circuits in portable computer, microprocessor, high power LED, internal storage module, cache, integrated circuits, DC/AC translator, IGBT and other power modules, encapsulation of semi-conductors, relay switches, rectifiers and transfomers

Typical values of TISTM580-12

Appearance White paste Test Method
Density(g/cm3,25℃) 1.2 ASTM D297
Tack-free time(min,25℃) ≤20 *****
Cure type(1-component) Dealcoholized *****
Viscosity@25℃ Brookfield (Uncured) 5000 cps ASTM D1084
Total cure time(d, 25℃) 3-7 *****
Elongation(%) ≥150 ASTM D412
Hardness(Shore A) 25 ASTM D2240
Lap Shear Strength(MPa) ≥2.0 ASTM D1876
Peel Strength(N/mm) >3.5 ASTM D1876
Operation temperature(℃) -60~250 *****
Volume Resistivity(Ω·cm) 2.0×1016 ASTM D257
Dielectric Strength(KV/mm) 21 ASTM D149
Dielectric Constant (1.2MHz) 2.9 ASTM D150
Thermal Conductivity W/(m·K) 1.2 ASTM D5470
Flame Retardancy UL94 V-0 E331100

Package:
300ml/tube
One Component Dealcoholized Thermally Conductive Silicone Adhesive for Room Temperature Curing Hardness 25 Shore A

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Working time: 8:00am - 5:30pm, Monday to Saturday (UTC+8).

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