Dongguan Ziitek Electronical Material and Technology Ltd.

Dongguan Ziitek Electronical Material and Technology Ltd. Professional TIM Manufacturer

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7 Years
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Silicone Thermal Pad Thermal Gap Pad For Motherboard LED Graphics Card GPU CPU

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Dongguan Ziitek Electronical Material and Technology Ltd.
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
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Silicone Thermal Pad Thermal Gap Pad For Motherboard LED Graphics Card GPU CPU

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Brand Name :Ziitek
Model Number :TIF100-30-05US
Certification :UL & RoHS
Place of Origin :China
MOQ :1000pcs
Price :0.1-10 USD/PCS
Payment Terms :T/T
Supply Ability :1000000 pcs/month
Delivery Time :3-5 work days
Packaging Details :24*23*12cm cantons
Products Name :3.0W/mK RoHS Compliance Silicone Thermal Pad Thermal Gap Pad For Motherboard LED Graphics Card GPU CPU
Thermal conductivity :3.0W/m-K
Outgassing(TML) :0.35%
Fire rating :94 V0
Dielectric Breakdown Voltage :>5500 VAC
Specific Gravity :3.0g/cc
Hardness :18 Shore 00
keywords :Thermal Gap Pad
Application :Mainboard/mother board
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3.0W/mK RoHS Compliance Silicone Thermal Pad Thermal Gap Pad For Motherboard LED Graphics Card GPU CPU


Company Profile

Dongguan Zhaoke Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

TIF100-30-05US-Series-Datasheet.pdf

Silicone Thermal Pad Thermal Gap Pad For Motherboard LED Graphics Card GPU CPU

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

TIF100-30-05US Series thermally conductive interface materials areapplied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make themsuited to coat very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entirePCB, which effecitly enhances the efficiency and life-time of

the heat-generating electronic components.

Features

> RoHS compliant 3.5W/mK
> UL recognized

> Naturally tacky needing no furtheradhesive coating
> Soft and Compressible for low stressapplications
> Available in varies thickness

Applications


> Memory Modules

> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)

Typical Properties of TIF100-30-05US Series
Color blue Visual
Construction & Compostion Ceramic filled silicone elastomer ***
Specific gravity 3.0g/cc ASTM D297
Thickness 4.0mmT ***
Hardness 18 Shore 00 ASTM 2240
Outgasing (TML) 0.35% ASTM E595
Continuos Use Temp -40 to 160℃ ***
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 4.0 MHz ASTM D150
Volume Resistivity(Ohm-cm) 1.0X1012 ASTM D257
Fire rating 94 V0 UL equivalent
Thermal conductivity 3.0 W/m-K ASTM D5470

Standard Thicknesses:


0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm) 0.040" (1.02mm) 0.050" (1.27mm)

0.060" (1.52mm) 0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm) 0.100" (2.54mm)

0.110" (2.79mm) 0.120" (3.05mm) 0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm) 0.190" (4.83mm) 0.200" (5.08mm)


Consult the factory alternate thickness.


Standard Sheets Sizes:


8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.


Peressure Sensitive Adhesive:


Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.


Reinforcement:


TIF™ series sheets type can add with fiberglass reinforced.

Silicone Thermal Pad Thermal Gap Pad For Motherboard LED Graphics Card GPU CPU

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

FAQ:

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

Q: How much are the pads?

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.

Silicone Thermal Pad Thermal Gap Pad For Motherboard LED Graphics Card GPU CPU

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