Dongguan Ziitek Electronical Material and Technology Ltd.

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High Temperature Waterproof Dull Black Solid Thermal Epoxy Glue for Electronic Components Potting

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Dongguan Ziitek Electronical Material and Technology Ltd.
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
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High Temperature Waterproof Dull Black Solid Thermal Epoxy Glue for Electronic Components Potting

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Brand Name :Ziitek
Model Number :TIE280-12AB
Certification :RoHS
Place of Origin :China
MOQ :10kg
Price :1-100USD/kg
Payment Terms :T/T
Supply Ability :10000kg/month
Delivery Time :3-8 work days
Packaging Details :1kg/can
Material :Epoxy glue
Usage :bonding electronics
Appearance sured :Black Solid
Continuous use temp :-40 to 160℃
Thermal conductivity :1.2 W/mK
Name :High Temperature Waterproof Dull Black Solid Thermal Epoxy Glue for Electronic Components Potting
Keywords :Thermal Epoxy Glue
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High Temperature Waterproof Dull Black Solid Thermal Epoxy Glue for Electronic Components Potting

Product Summary:

TIE™280-12AB is a two compound, high thermal conductive, low temperature cured, long pot life,fire resistant epoxy encapsulant compound. lt is design for potting of capacitors and electricaldevices.

TIE280-12AB-Series-Datasheet.pdf

High Temperature Waterproof Dull Black Solid Thermal Epoxy Glue for Electronic Components Potting

Feature

> Good thermal conductive: 1.2W/mK
> Excellent insulation and smoothly sourface.

> Low shrinkage
> Low viscosity , expediting air releaseed.

> Excellent in solvents and water proof.

> Longer life time.
> Excellent thermal shock efficiecy andimpact resistance

Applications

> Automotive starters potting; General potting;

> Thermal detector potting
> Ferrite adhesion; TIP type LED; Good adhesion toaromatic polyester
> Relay sealant; Good adhesion to rubber, ceramics,PCB and plastics
> Power transformers and coils; Potting capacitors;Potting of small electrical devices
> Adhesion to metal glass and plastic;LCD & substrates adhesion; Coating and sealant;Coil ; IGBTS;Transformer; Fire retardant
> Optical / medical component adhesive

Typical Properties of TIE280-12AB Series
Typical Uncured Material
TIETM280-12A(Resin) Mixing ratio (weight ratio)
A:=1 :1
Color Black
Viscosity @25℃ Brookfield 15000 cPs Viscosity @25℃ Brookfield 10000 cPs
Operating time (@25℃) 45 mins
Shelf life @25℃ in sealed 12 months specific Gravity 1.6 g/cc
Mixture Color Black
TIE280-12B(Hardener) Cure Schedule
Color Black Cure at 25C 3 hrs
Viscosity @25℃ Brookfield 7000 cPs
Shelf life @25℃ in sealed container 12 months Cure at 7o°c 30 mins
Cured Properties
Hardness @25℃ 85 Shore D
Operating temperature -40℃ ~160℃
Glass transition temperature Tg 92℃
Rate of tension 0.10%
Coefficient of thermal expansion, /℃ 3.0x 10^(-5)
Fire resistance uL 94 V-0
Moisture absorption % wt gain 24 hours water immersion @25℃ <0.1%
Thermal Conductivity 1.2 W/m-K
Dielectric Breakdown Voltage 300 volts / mil
Dielectric Constant@1MHz 4.2
volume resistivity, ohm-cm @ 25℃ 3.0x 10^13

Package:

1kg/can

5KG A/B each.

10KG A/B each.

High Temperature Waterproof Dull Black Solid Thermal Epoxy Glue for Electronic Components Potting

Comapany Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

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