Dongguan Ziitek Electronical Material and Technology Ltd.
Dongguan Ziitek Electronical Material and Technology Ltd. Professional TIM Manufacturer
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5.0W/mK Gray UL Recognized Conductive Pads for Heat Pipe Thermal Solutions
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market.
Our vast experience allows us to assist our customers best in thermal engineering field.
We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
TIF100N-50-10F-Specification-sheet.pdf
Ziitek TIF1120N-50-10F is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.
<RoHS compliant
<UL recognized
<Easy release construction
<mainboard/mother board
<notebook
<power supply
<Heat pipe thermal solutions
<Memory Modules
<Mass storage devices
| Typical Properties of TIF1120N-50-10F | |||
| Product Name | TIF1120N-50-10F Series | ||
| Colour | Gray | ||
| Construction & Compostion | Ceramic filled silicone elastomer | ||
| Specific gravity | 2.1 g/cm^3 | ||
| Thickness | 3.0mmT | ||
| Hardness | 55±5 Shore 00 | ||
| Dielectric constant@1MHz | 4.7 MHz | ||
| Continuos Use Temp | -40 to 160℃ | ||
| Dielectric Breakdown Voltage | >5500 VAC | ||
| Thermal conductivity | 5.0W/mK | ||
| Flame Rating | 94-V0 | ||
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
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