Dongguan Ziitek Electronical Material and Technology Ltd.
Dongguan Ziitek Electronical Material and Technology Ltd. Professional TIM Manufacturer
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2.0mmT Popular and High Cost-effective Silicone Pads for Notebook,Specific Gravity 2.1 g/cm^3
Company Profile
Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.
TIF100N-40-10F-Specification-sheet.pdf
Ziitek TIF180N-40-10F is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
<Electrically isolating
<High durability
<Good thermal conductive
<mainboard/mother board
<notebook
<power supply
<Heat pipe thermal solutions
<Memory Modules
<Mass storage devices
| Typical Properties of TIF180N-40-10F | |||
| Product Name | TIF180N-40-10F Series | ||
| Colour | Gray | ||
| Construction & Compostion | Ceramic filled silicone elastomer | ||
| Specific gravity | 2.1 g/cm^3 | ||
| Thickness | 2.0mmT | ||
| Hardness | 55±5 Shore 00 | ||
| Dielectric constant@1MHz | 4.7 MHz | ||
| Continuos Use Temp | -40 to 160℃ | ||
| Dielectric Breakdown Voltage | >5500 VAC | ||
| Thermal conductivity | 4.0W/mK | ||
| Volume Resistivity | 1.0*1012 Ohm-cm | ||
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
FAQ
Q: How do I request customized samples?
A: To request samples, you can leave us message on website, or just contact us by send email or call us.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.