Dongguan Ziitek Electronical Material and Technology Ltd.

Dongguan Ziitek Electronical Material and Technology Ltd. Professional TIM Manufacturer

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Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules

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Dongguan Ziitek Electronical Material and Technology Ltd.
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Province/State:guangdong
Country/Region:china
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Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules

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Brand Name :Ziitek
Model Number :TIF1120-30-02US thermal pad
Certification :UL
Place of Origin :China
MOQ :1000 pcs
Price :0.1-10 USD/PCS
Payment Terms :T/T
Supply Ability :100000pcs/month
Delivery Time :3-8 work days
Packaging Details :25*24*13cm canton
Dielectric constant@1MHz :3.8 MHz
Product Name :TIF1120-30-02US Series
Application :power supply
color :gray
Name :Dielectric constant 3.8 MHz Soft and Compressible Thermal Pad for Memory Modules
keyword :Thermal Gap Pad
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Dielectric constant 3.8 MHz Soft and Compressible Thermal Pad for Memory Modules

Company Profile

With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

TIF100-30-02US-Datasheet-REV02.pdf

Ziitek TIF1120-30-02US is not only designed to take advantage of the gap heat transfer, to fill gaps, complete the heat transfer between heating and cooling parts, but also played insulation, damping, sealing and so on, to meet the equipment miniaturization and ultra-thin design Requirements, which is a highly technology and use, and the thickness of the wide range of applications, is also an excellent thermal conductivity filler material.

<Good thermal conductive:3.0W/mK
<Thickness:3.0mmT
<Hardness:20 Shore 00
<Colour: gray

<RoHS compliant

<UL recognized

<Easy release construction

Applications

<mainboard/mother board

<notebook

<power supply

<Heat pipe thermal solutions

<Memory Modules

<Mass storage devices

Typical Properties of TIF1120-30-02US
Product Name

TIF1120-30-02US Series

Colour
Gray
Construction & Compostion
Ceramic filled silicone elastomer

Specific gravity

2.9 g/cc

Thickness

3.0mmT
Hardness
20 Shore 00
Dielectric constant@1MHz
3.8 MHz
Continuos Use Temp
-40 to 160℃

Dielectric Breakdown Voltage

>5500 VAC
Thermal conductivity
3.0 W/mK
Volume Resistivity

1.0*1012 Ohm-cm


Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied.

Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract

Dielectric Constant 3.8 Mhz Cpu Thermal Pad Soft Compressible For Memory Modules

FAQ

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

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