Dongguan Ziitek Electronical Material and Technology Ltd.
Dongguan Ziitek Electronical Material and Technology Ltd. Professional TIM Manufacturer
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Excellent Wet-Out Thermal Pad for High speed mass storage drives,5.0mmT TIF1200-30-11US
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
<Outstanding thermal performance
<High tack surface reduces contact resistance
<Fiberglass reinforced for puncture, shear and tear resistance
<Easy release construction
<High speed mass storage drives
<Heat Sinking Housing at LED-lit BLU in LCD
<LED TV and LED-lit lamps
<GPS navigation and other portable devices
<CD-Rom, DVD-Rom cooling
<LED Power Supply
<LED Controller
<LED Ceilinglamp
| Typical Properties of TIF1200-30-11US | |||
| Product Name | TIF1200-30-11US Series | ||
| Colour | gray | ||
| Construction & Compostion | Ceramic filled silicone elastomer | ||
| Specific gravity | 3.0 g/cc | ||
| Thickness | 5.0mmT | ||
| Hardness | 20±5Shore 00 | ||
| Dielectric constant@1MHz | 4.0 MHz | ||
| Continuos Use Temp | -40to 160℃ | ||
| Dielectric Breakdown Voltage | >5500 VAC | ||
| Thermal conductivity | 3.0W/mK | ||
| Volume Resistiviyt | 1.0*1012 Ohm-cm | ||
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
FAQ
Q: What kind of packaging you offer?
A: During the packaging process, preventive measures will be taken by us to assure that the goods are in a good condition during storage and delivery.
Q: What's the thermal conductivity test method given on the data sheet ?
A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.