Dongguan Ziitek Electronical Material and Technology Ltd.

Dongguan Ziitek Electronical Material and Technology Ltd. Professional TIM Manufacturer

Manufacturer from China
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7 Years
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Ultra Soft CPU Thermal Pad For Telecommunication Hardware

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Dongguan Ziitek Electronical Material and Technology Ltd.
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
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Ultra Soft CPU Thermal Pad For Telecommunication Hardware

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Brand Name :Ziitek
Model Number :TIF112-12-10S-K1
Certification :UL & RoHS
Place of Origin :China
MOQ :1000pcs
Price :0.1-10 USD/PCS
Payment Terms :T/T
Supply Ability :1000000 pcs/month
Delivery Time :3-5 work days
Packaging Details :24*23*12cm cantons
Products name :Ultra Soft CPU Thermal Pad For Telecommunication Hardware
Thickness :0.012"(0.30mm)
Specific Gravity :2.2g/cc
Dielectric Breakdown Voltage :>5500 VAC
Thermal conductivity :1.2W/m-K
color :Gray
Operating Temp :-40~120℃
Keywords :CPU Thermal pad
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Ultra Soft CPU Thermal Pad For Telecommunication Hardware

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Product introduction


TIF112-12-10S-K1 Series thermally conductive interface materials are gap fillers reinforced one side with kepton; the other side with adhesive.They are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and viscoelastic feature make them ideal to coat very uneven surfaces. lts smooth, puncture, tear, wear-resistant reinforcement surface is perfect for reworking and plug-in devices.

Ultra Soft CPU Thermal Pad For Telecommunication Hardware

Features
> Good thermal conductive: 1.2W/mK
> Available in varies thickness
> UL recognized
> Broad range of hardnesses available
> Moldability for complex parts
> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant

Applications
> LED TV / LED Lit Lamps
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
> Audio and video components
> IT infrastructure
> GPS navigation and other portable devices

Typical Properties of TIF112-12-10S-K1 Series
Property Value Test method
Color Gray/ Light amber Visual
Construction &Compostion Ceramic filled silicone elastomer ***
Renforcement carrier Polyimide film ***
Thickness range 0.012"(0.30mm) ASTM D374
Hardness 60±5 Shore C ASTM 2240
Specific Gravity 2.2 g/cc ASTM D792
Continuos Use Temp -40 to 120℃ ***
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity 1.0X10¹²"Ohm-meter ASTM D257
Fire rating 94 V0 UL E331100
Thermal conductivity 1.2W/m-K ASTM D5470

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

Ultra Soft CPU Thermal Pad For Telecommunication Hardware

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