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Telephone Cooling Conductive Insulation Thermal Pad Adhesion Thermal Conductive Silicone Pad
The TIF160-07E Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
Features
> Good thermal conductive: 1.5W/mK
> Available in varies thickness
> UL recognized
> Broad range of hardnesses available
> High tack surface reduces contact resistance
> Electrically isolating
> RoHS compliant
Applications
> LED TV / LED Lit Lamps
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Memory Modules
> Heat pipe thermal solutions
> Mass storage devices
> Automotive electronics
> Radios
> Power electronics
Typical Properties of TIF160-07E Series | ||||
Color | Green | Visual | Composite Thickness | Thermal Impedance @10psi (℃-in²/W) |
Construction & Compostion | Ceramic filled silicone elastomer | *** | 10mils / 0.254 mm | 0.16 |
20mils / 0.508 mm | 0.20 | |||
Specific Gravity | 2.3g/cc | ASTM D297 | 30mils / 0.762 mm | 0.31 |
40mils / 1.016 mm | 0.36 | |||
Thickness range | 0.020"-0.200"(0.5mm~5.0mm) | ASTM C351 | 50mils / 1.270 mm | 0.42 |
60mils / 1.524 mm | 0.48 | |||
Hardness | 35Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.53 |
80mils / 2.032 mm | 0.63 | |||
Dielectric Breakdown Voltage
| >5500 VAC | ASTM D412 | 90mils / 2.286 mm | 0.73 |
100mils / 2.540 mm | 0.81 | |||
Continuos Use Temp
| -45 to 200℃ | *** | 110mils / 2.794 mm | 0.86 |
120mils / 3.048 mm | 0.93 | |||
Outgassing(TML) | 0.35% | ASTM E595 | 130mils / 3.302mm | 1.00 |
140mils /3.556 mm | 1.08 | |||
Dielectric Constant | 4.7 MHz | ASTM D150 | 150mils / 3.810 mm | 1.13 |
160mils / 4.064 mm | 1.20 | |||
Volume Resistivity | 1.0X10¹² Ohm-meter | ASTM D257 | 170mils / 4.318 mm | 1.24 |
180mils / 4.572 mm | 1.32 | |||
Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 1.41 |
200mils / 5.080 mm | 1.52 | |||
Thermal conductivity | 1.5W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field. We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!
Ziitek Culture
Quality :
Do it right the first time, total quality control
Effectiveness:
Work precisely and thoroughly for effectiveness
Service:
Quick response, On time delivery and Excellent service
Team work:
Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.