Dongguan Ziitek Electronical Material and Technology Ltd.

Dongguan Ziitek Electronical Material and Technology Ltd. Professional TIM Manufacturer

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7 Years
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1.5W/MK Thermally Conductive Gap Filler Ziitek Thermally Pad Thermal Interface Materials TIF100 Heat Transfer Pads

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Dongguan Ziitek Electronical Material and Technology Ltd.
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
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1.5W/MK Thermally Conductive Gap Filler Ziitek Thermally Pad Thermal Interface Materials TIF100 Heat Transfer Pads

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Brand Name :Ziitek
Model Number :TIF120-07E Series
Certification :UL & RoHS
Place of Origin :China
MOQ :1000pcs
Price :0.1-10 USD/PCS
Payment Terms :T/T
Supply Ability :1000000 pcs/month
Delivery Time :3-5 work days
Packaging Details :24*13*12cm cartons
Product ame :1.5W/MK Thermally Conductive Gap Filler Ziitek Thermally Pad Thermal Interface Materials TIF100 Heat Transfer Pads
Thickness :0.5mmT
Specific Gravity :2.3 g/cc
Dielectric Breakdown Voltage :>5000 VAC
Thermal conductivity :1.5W/m-K
color :green
Keywords :Thermally Conductive Gap Filler
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1.5W/MK Thermally Conductive Gap Filler Ziitek Thermally Pad Thermal Interface Materials TIF100 Heat Transfer Pads

Company Profile

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.


The TIF120-07E Series hermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.


Features
> Good thermal conductive: 1.5W/mK
> Available in varies thickness
> UL recognized
> Broad range of hardnesses available
> High tack surface reduces contact resistance

> Electrically isolating

Applications
> LED TV / LED Lit Lamps
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> Memory Modules
> routers
> Telecommunication hardware

> mainboard/mother board

> IT infrastructure

> GPS navigation and other portable devices

Typical Properties of TIF100-07E Series
Color Green Visual
Construction Ceramic filled silicone elastomer **********
Thermal Conductivity 1.5 W/mK ASTM D5470
Hardness 35 Shore 00 ASTM 2240
Specific Gravity 2.3 g/cc ASTM D297
Thickness range 0.020"-0.200" (0.5mm-5.0mm) ASTM D374
Dielectric Breakdown Voltage (T= 1mm above) >5500 VAC ASTM D149
Dielectric Constant 4.7MHz ASTM D150
Volume Resistivity 1.0X10¹² Ohm-meter ASTM D257
Continuous Use Temp – 45To 200℃ **********
Outgassing (TML) 35% ASTM E595
Flame Rating 94-V0 UL E331100

Product Specification
Product Thicknesses: 0.020-inch to 0.200-inch (0.5mm to 5.0mm)

Product Sizes: 8" x 16"(203mm x406mm)
Individual dieoutshapesand andcustomthicknesscanbesupplied.Peasecontactusforconfirming

TIF™ series Individual die cut shapes can be supplied.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

1.5W/MK Thermally Conductive Gap Filler Ziitek Thermally Pad Thermal Interface Materials TIF100 Heat Transfer Pads

Advantage

Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.

They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.

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