Dongguan Ziitek Electronical Material and Technology Ltd.

Dongguan Ziitek Electronical Material and Technology Ltd. Professional TIM Manufacturer

Manufacturer from China
Verified Supplier
7 Years
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Factory Supply Ultra Soft 1.5W Customized Die-Cutting Heatsink Thermal Pad For Laptop Led Cpu Gpu

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Dongguan Ziitek Electronical Material and Technology Ltd.
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
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Factory Supply Ultra Soft 1.5W Customized Die-Cutting Heatsink Thermal Pad For Laptop Led Cpu Gpu

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Brand Name :Ziitek
Model Number :TIF100-01E
Certification :UL & RoHS
Place of Origin :China
MOQ :1000pcs
Price :0.1-10 USD/PCS
Payment Terms :T/T
Supply Ability :1000000 pcs/month
Delivery Time :3-5 work days
Packaging Details :24*13*12cm cartons
Product name :Factory Supply Ultra Soft 1.5W Customized Die-Cutting Heatsink Thermal Pad For Laptop Led Cpu Gpu
Thickness :1.5mmT
Keywords :Thermal pad
Specific Gravity :2.3g/cc
Dielectric Breakdown Voltage :>5500 VAC
Thermal conductivity :1.5W/m-K
Color :Black
Sample :Sample available
Application :Electronic Component Gap Filling
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Factory Supply Ultra Soft 1.5W Customized Die-Cutting Heatsink Thermal Pad For Laptop Led Cpu Gpu

Company Profile

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.


The TIF160-06E Series is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.
Factory Supply Ultra Soft 1.5W Customized Die-Cutting Heatsink Thermal Pad For Laptop Led Cpu Gpu
Features


> Good thermal conductive: 1.5W/mK
> Available in varies thickness
> UL recognized
> Broad range of hardnesses available
> High tack surface reduces contact resistance

> Electrically isolating


Applications


> display card
> mainboard/mother board
> notebook
> power supply
> CPU
> Memory Modules
> routers
> Telecommunication hardware

> mainboard/mother board

> IT infrastructure

> Automotive electronics

Typical Properties of TIF100-66U Series
Property Value Test method
Color Black Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density 2.3g/cm³ ASTM D297
Thickness range 0.020"(0.5mm)~0.200"(5.0mm) ******
Hardness 35 Shore 00 ASTM 2240
Continuos Use Temp -45 to 200℃ ******
Dielectric Breakdown Voltage >5500 VAC ASTM D149
Dielectric Constant 4.7 MHz ASTM D150
Volume Resistivity(Ohm-cm) 1.0X1012 ASTM D257
Fire rating 94 V0 UL equivalent
Thermal conductivity 1.5W/m-K ASTM D5470

Standard Thicknesses:

0.010" (0.25mm) 0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
Individual die cut shapes and custom thickness can be supplied.

Please contact us of confirming.


Peressure Sensitive Adhesive:
Request adhesive on one side with "A1" suffix.
Request adhesive on double side with "A2" suffix.


Reinforcement:
TIF™ series sheets type can add with fiberglass reinforced.

Factory Supply Ultra Soft 1.5W Customized Die-Cutting Heatsink Thermal Pad For Laptop Led Cpu Gpu

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Ziitek Culture

Quality :

Do it right the first time, total quality control

Effectiveness:

Work precisely and thoroughly for effectiveness

Service:

Quick response, On time delivery and Excellent service

Team work:

Complete teamwork, including sales team, Marketing team, engineering team, R&D team, Manufacturing team, logistics team. All is for supporting and servicing a satisfy service for customers.

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