Dongguan Ziitek Electronical Material and Technology Ltd.

Dongguan Ziitek Electronical Material and Technology Ltd. Professional TIM Manufacturer

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1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application

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Dongguan Ziitek Electronical Material and Technology Ltd.
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
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1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application

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Brand Name :Ziitek
Model Number :TIF100-10-01U Series
Certification :UL & RoHS
Place of Origin :China
MOQ :1000pcs
Price :0.1-10 USD/PCS
Payment Terms :T/T
Supply Ability :1000000 pcs/month
Delivery Time :3-5 work days
Packaging Details :24*23*12cm cantons
Products name :1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application
Thickness :0.5~5.0mm
Specific Gravity :2.1 g/cc
Dielectric Breakdown Voltage :>5000 VAC
Thermal conductivity :1.0W/m-K
Keywords :Silicone Thermal pad
Hardness :27 ShoreA
Application :High Temperature Application
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1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.


The TIF100-10-01U Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

TIF100-10-01U-TDS_EN_REV02-.pdf


1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application

Features
> Good thermal conductive: 1.0W/mK
> RoHS compliant
> UL recognized
> Tear resistance
> Easy release construction
> Electrically isolating
> High durability


Applications
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board

Typical Properties of TIF100-10-01U Series
Color Dark gray Visual
Construction &Compostion Ceramic filled silicone elastomer ***
Specific Gravity 2.1g/cc ASTM D297
Thickness range 0.020"(0.5mm)~0.200"(5.0mm) ASTM C351
Hardness 27 Shore 00 ASTM 2240
Dielectric Breakdown Voltage >5000 VAC ASTM D412
Continuos Use Temp -40 to 160℃ ***
Outgassing(TML) 0.35% ASTM E595
Dielectric Constant 4.5 MHz ASTM D150
Volume Resistivity 1.0X10¹² Ohm-meter ASTM D257
Fire rating 94 V0 equivalent UL
Thermal conductivity 1.0W/m-K ASTM D5470
Standard Sheets Sizes:


8" x 16"(203mm x 406mm) 16" x 18"(406mm x 457mm)
TIF™ series Individual die cut shapes can be supplied.

Peressure Sensitive Adhesive:

Request adhesive on one side with "A1" suffix.

Request adhesive on double side with "A2" suffix.

Reinforcement: TIF™ series sheets type can add with fiberglass reinforced.

1.0W/M-K Silicone Thermal Gap Filler Thermal Pad For High Temperature Application

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.

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