Dongguan Ziitek Electronical Material and Technology Ltd.
Dongguan Ziitek Electronical Material and Technology Ltd. Professional TIM Manufacturer
Add to Cart
China company supplied Good thermal conductive 4.7MHz Thermal Conductive Gap Filler Pad For CPU
Company Profile
With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.
The TIF1100-07E Series use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.
Features
> Good thermal conductive: 1.5W/mK
> Available in varies thickness
> Easy release construction
> Broad range of hardnesses available
> High tack surface reduces contact resistance
> Soft and Compressible for low stress applications
> Fiberglass reinforced for puncture, shear and tear resistance
Applications
> LED TV / LED Lit Lamps
> CD-Rom, DVD-Rom cooling
> SAD-DC Power Adapters
> CPU
> display card
> Micro heat pipe thermal solutions
> Memory Modules
> routers
> Telecommunication hardware
> Heat pipe thermal solutions
>GPS navigation and other portable devices
>Audio and video components
| Typical Properties of TIF1100-07E Series | ||||
| Color | Green | Visual | Composite Thickness | Thermal Impedance @10psi (℃-in²/W) |
| Construction & Compostion | Ceramic filled silicone elastomer | *** | 10mils / 0.254 mm | 0.16 |
| 20mils / 0.508 mm | 0.20 | |||
| Specific Gravity | 2.3 g/cc | ASTM D297 | 30mils / 0.762 mm | 0.31 |
| 40mils / 1.016 mm | 0.36 | |||
| Thickness range | 0.020"-0.200" | ASTM C351 | 50mils / 1.270 mm | 0.42 |
| 60mils / 1.524 mm | 0.48 | |||
| Hardness | 35 Shore 00 | ASTM 2240 | 70mils / 1.778 mm | 0.53 |
| 80mils / 2.032 mm | 0.63 | |||
| Dielectric Breakdown Voltage
| >5500 VAC | ASTM D412 | 90mils / 2.286 mm | 0.73 |
| 100mils / 2.540 mm | 0.81 | |||
| Continuos Use Temp
| -40 to 160℃ | *** | 110mils / 2.794 mm | 0.86 |
| 120mils / 3.048 mm | 0.93 | |||
| Outgassing(TML) | 0.35% | ASTM E595 | 130mils / 3.302mm | 1.00 |
| 140mils /3.556 mm | 1.08 | |||
| Dielectric Constant | 4.7MHz | ASTM D150 | 150mils / 3.810 mm | 1.13 |
| 160mils / 4.064 mm | 1.20 | |||
|
Volume Resistivity | 1.0X10" Ohm-meter | ASTM D257 | 170mils / 4.318 mm | 1.24 |
| 180mils / 4.572 mm | 1.32 | |||
| Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 1.41 |
| 200mils / 5.080 mm | 1.52 | |||
| Thermal conductivity | 1.5W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.
Standard Thicknesses:
0.020" (0.51mm) 0.030" (0.76mm)
0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)
0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)
0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)
0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)
0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)
0.190" (4.83mm) 0.200" (5.08mm)
Consult the factory to alternate thickness.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Advantage
Ziitek has independent R&D team. This team is experience, rigorous and pragmatic.
They undertake the core research and development tasks of Ziitek thermal conductive materials. With well-equipped testing equipment, we Ziitek can also do some tests with customers' samples, so we can find a more suitable Ziitek materials for every customer.
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract