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Dongguan Ziitek Electronical Material and Technology Ltd.

Dongguan Ziitek Electronical Material and Technology Ltd. Professional TIM Manufacturer

Manufacturer from China
Verified Supplier
7 Years
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Home / Products / Thermal Epoxy Glue / Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation /

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Silicone Thermal Pad

 [136]

Heat Sink Thermal Pad

 [163]

CPU Thermal Pad

 [226]

Thermal Graphite Sheet

 [24]

Thermally Conductive Electrical Insulator

 [23]

PCM Phase Change Material

 [22]

Double Sided Thermal Tape

 [22]

Heat Conductive Plastic

 [9]

High Temperature Thermal Grease

 [15]

Thermally Conductive Potting Compound

 [9]

Thermal Epoxy Glue

 [9]

Thermal Conductive Silicone Adhesive

 [4]

Thermal Conductive Gel

 [23]

Shielding Absorbing Materials

 [22]

Silicone Foam Sheet

 [6]

Silicone Free Thermal Pad

 [12]

Most Popular Products

 [11]

Film Heating Element

 [6]
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Dongguan Ziitek Electronical Material and Technology Ltd.
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City:dongguan
Province/State:guangdong
Country/Region:china
Contact Person:MsDana Dai
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Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation
Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation
  • Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation
  • Low Shrinkage One Component Thermal Epoxy Glue For Electronic Product Encapsulation
Products Detailed
4.5W/mK thermal conductivity heat cured epoxy adhesive for bonding two parts of electronics Product Summary: TIE™380-45 is a one component, heat cured ...
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Product Tags:
reactive hot melt polyurethane adhesive heat resistant metal glue heat resistant glue for metal

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